Industry Speakers

Schedule - July 11

9:3010:00Real Printed Electronics Applications: Past, Present and FutureKhasha Ghaffarzadeh
10:0010:30Progress of Organic Semiconductor based NIR-SWIR Image SensorPhoebe Tan
10:3011:00Flexing the Future: Innovations in Flat Panel Manufacturing for Cutting-Edge Flexible Electronics ApplicationsJerome Crocco
11:0011:15Coffee Break 
11:1511:45Additive Manufacturing of Electronics and Advanced Packaging: A Semiconductor Foundry in a BoxAhmed Busnaina
11:4512:15Development of an OTFT PDK for Low-Voltage, Flexible Logic Circuits on Plastic SubstratesAlejandro Carreras
12:1512:45Flexible RF Applications Using AMERyan Bahr
  • Progress of Organic Semiconductor based NIR- SWIR Image Sensor

    The interests of using organic semiconductor as the photodetector for image sensor application is on the rise. Raynergy Tek’s R&D has demonstrated a bulk-heterojunction (BHJ) organic composite featuring a self-filtering light responsive characteristic at Near Infrared level.

  • Additive Manufacturing of Electronics and Advanced Packaging: A Semiconductor Foundry in a Box

    We introduce a scalable and sustainable technology that enables the additive manufacturing of nano and microelectronics, electronic components, and RDL and can reduce the cost by 10-100 times compared to conventional fabrication and be 1000 times faster and 1000 smaller structures than ink-jet-based printing.  The nano and microscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. Printed applications, such as transistors, inverters, diodes, and logic gates, were demonstrated, and displays at the micro and nanoscale using inorganic and organic materials will be presented. The capability of printing RDL, passive and active components monolithically allows the reduction of a board (such as an IOT board) to be within a few mm of the original IC (chip) footprint. Additionally, the number of parts used will be reduced by more than 75% and the footprint by more than 90% to reduce size and weight.

  • Development of an OTFT PDK for Low-Voltage, Flexible Logic Circuits on Plastic Substrates

    At SmartKem, in our pursuit to develop long-term impact to the field of high quality, high mobility, organic semiconductor materials, we have developed 5V and 3.3V operational logic, with a dual-gate OTFT architecture. Through this, we aim to bring the numerous benefits of OTFT, such as low power consumption - thanks to the power-saving dual gate OTFT compared to PMOS single-gate - and its hybrid integration with CMOS technology, in large area applications, on flexible and printed substrates.

    For this technology to thrive, of course, there is a strong need for an open-source platform development kit, to enable RTL to GDS synthesis, without the required detailed knowledge of OTFT technology. In this talk, we want to open the floor to questions and reflections, while discussing our current development of an OpenROAD/OpenLane semi-custom PDK.

  • Flexing the Future: Innovations in Flat Panel Manufacturing for Cutting-Edge Flexible Electronics Applications

    InnovaFlex Foundry is a leading force in the evolution of flat panel display technologies within the United States. Our primary focus is on refining and perfecting the fabrication processes for amorphous Silicon (a-Si) as well as IGZO on Gen 4.5 substrates. Our advanced manufacturing processes deliver highly efficient and cost-effective solutions, driving advancements across a broad range of technologies and fulfilling the burgeoning demand within the key markets.
     

  • Real Printed Electronics Applications: Past, Present, and Future

    Printed electronics is everywhere and yet seems elusive. It is in diverse products ranging from baby diapers to consumer electronics to solar cells to precision missiles, and yet many feel the predicted growth rates have failed to materialize especially as many users still opt for conventional electronics when faced with the complexities of printed electronics.

    In this talk, we offer an overview of the past, present and future of printed electronic applications. We will showcase and review applications - which are either in the market or are close to commercialization - covering photovoltaics, MLCCs, human-machine-interfaces /HMIs, biosensors, automotive interiors, displays (OLED, QDs and microLEDs), lighting, wearable devices, medical sensors, and many more.

    In doing so we will demonstrate the depth and breadth of the industry and offer perspective on the future direction of development 

  • Flexible RF Applications Using AME

    Industry is showing increased interest and adoption of additive manufactured electronics (AME) for rapid prototyping or innovating novel designs. With a focus on the capabilities of inkjet printing (such as the DragonFly IV), I discuss emerging flexible RF-applications based on academic literature and discussions with industry, as well as highlight future direction of integration of different technologies and novel applications.