July 9 - 12, 2023
Boston, Massachusetts, USA

About IEEE FLEPS 2023

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) will be held in Boston, Massachusetts, USA.

Mark Your Calendars

Key Dates

  1. 2023-03-12

    Initial Paper Submission Deadline

  2. 2023-04-21

    Notification of Acceptance

  3. 2023-05-05

    Final Manuscript Submission Deadline

  4. 2023-06-16

    Standard Registration Deadline


Call for Papers

Calling all Authors!

Download the IEEE FLEPS 2023 Call for Papers!

IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

Interest Areas

Topics of Interest

  • Organic/Inorganic Electronics and Sensors
  • Advanced Manufacturing Techniques
  • Hybrid Flexible Sensors and Electronics
  • Soft/Smart Wearable and Implantable Sensing Systems
  • Printed Large-Area Sensors and Systems
  • Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
  • Flexible/Printable Electronics in context with Circular and Green Electronics
  • Emerging Materials for Flexible and Printable Systems
  • High-throughput Printable Electronics
  • Stretchable/Shrinkable Sensors and Electronics
  • Disposable/Reusable Sensors and Electronics
  • Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
  • Reliability, Simulation and Modelling

FLEPS 2023 Newsletter
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