July 9 - 12, 2023
Boston, Massachusetts, USA

About IEEE FLEPS 2023

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) will be held in Boston, Massachusetts, USA.

Mark Your Calendars

Key Dates

  1. 2023-07-09


  2. 2023-07-10

    Conference Starts

  3. 2023-07-12

    Conference Ends

WiSe-YP Big Idea Pitch Competition

This competition is to motivate young students/researchers to develop entrepreneurial and business mindsets with their skills and training on sensor research and development.

Competition Rules

  • A three-minute oral pitch presentation with four slides about a business idea based on the presenter’s research project(s).
  • The first slide is for the title, presenter, affiliation and credentials. The other 3 slides focus on “the Problem”, “Solution(s)”, and “Expected Outcomes”.
  • The teams can bring what they can carry
  • Each team can have 1 or max 2 participants.
  • Eligible for students, postdoctoral fellows, and young professionals (defined as within 15 years from B.Sc. degree by the IEEE YP program)
  • One-page proposal should be submitted on or before. 31st May 2023. The proposal should include a project Title, the Problem, Solution(s), and Expected Outcomes.
  • The judging and mentoring panel will consist of entrepreneurs and academic researchers.

Online Pitch Coaching Session

Date and time: 9AM PST on June 27, 2023

Coach: Joseph Wei, Technology Ventures Group

Meeting link will be sent to the accepted participants

Interest Areas

Topics of Interest

  • Organic/Inorganic Electronics and Sensors
  • Advanced Manufacturing Techniques
  • Hybrid Flexible Sensors and Electronics
  • Soft/Smart Wearable and Implantable Sensing Systems
  • Printed Large-Area Sensors and Systems
  • Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
  • Flexible/Printable Electronics in context with Circular and Green Electronics
  • Emerging Materials for Flexible and Printable Systems
  • High-throughput Printable Electronics
  • Stretchable/Shrinkable Sensors and Electronics
  • Disposable/Reusable Sensors and Electronics
  • Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
  • Reliability, Simulation and Modelling

FLEPS 2023 Newsletter
Sent straight to your inbox!